Expertise in (OCP) Open Compute Project Hardware

Expertise in (OCP) Open Compute Project Hardware
Focus

Pioneering sustainability in IT infrastructures and data centers!

In the ever-evolving landscape of data centers, Circle B stands at the forefront of innovation, leading the charge towards a greener and more sustainable future. As the industry steers towards net carbon zero goals in the coming decade, we are proud to be an integral part of the OCP Sustainability Project, actively shaping the future of data center sustainability within the Open Compute Project ecosystem.

Our Vision: A Sustainable Tomorrow

At Circle B, our vision extends beyond mere technological advancements; we aim to revolutionize the very core of data center operations. Our collaboration with the OCP Sustainability Project has ushered in a new era, introducing Sustainability as the fifth tenet into OCP. This fundamental change reflects our commitment to addressing the unique challenges and opportunities presented within the Open Compute Project ecosystem.

Examples

Atlancis Technologies, an OCP SP based in Nairobi, Kenya, is offering Circular Economy solutions as an integrated cloud platform, which has reduced implementation costs by as much as 80% compared to a traditional infrastructure.

But also:

Sustainability in Action: Liquid Cooling and Density

One of the pivotal aspects of our sustainability initiative is the exploration of liquid cooling and density solutions. The rising demands for higher-speed components and increased server power consumption have led to the need for innovative cooling solutions. Circle B, in collaboration with industry leaders, is exploring various liquid cooling technologies, including direct-to-chip and immersion cooling.

OCP Sustainability - Data Center Efficiency Metrics (2023)

OCP Impact Study - Open Computing and Data Center Sustainability

White papers and handy links

This table captures ICT-embodied carbon initiatives happening external to OCP.

Entity

Description

Notes

IMEC-SSTS

Environmental data; thus enabling environmental aspects, is included in trade-offs early in the design phase of ICs. 

Spec from this work pertaining to chipsets could take feedback/ alignment with IMEC effort.

PAIA (MIT)

MIT led an artnership on a commercial tool for system (server, laptops) level product carbon footprint estimation and reporting.

Methodology (most significant product attributes) and tool have been around for more than a decade. Currently undergoing revision with participants spanning OEMs & CSP. IC module is being led by Intel, Alignment is WIP.

SEMI Sustainability

Industry consortium to align to GHG accounting, representation across equipment, material, fabrication, Assembly, OEM

Intel is leading the Scope3 accounting WG. Separate WGs addressing Scopes1, 2 m

Green Software Foundation (GSF)

Best practices, and knowledge base to help developers reduce the carbon intensity of software

SCI spec includes embodied carbon.

(IEC)
IEC 63336

Considering the digitalization of Product Carbon Footprint 

3-5 years time frame for creation. A horizontal standard IEC 63366 to define (PCR) for electronic and electrical products and systems (EEPS) is currently under review. This is the most relevant to ICs products. 

Open Footprint

IT industry non-profit (cross-segment) standards WG, developing a common data model, standards & reference architecture for CO2e, water, land footprint

Spec from this work pertaining to data standards & API could benefit from cross-checking/alignment with this group’s work.

ISO LCA Standards

 

https://www.iso.org/standard/60856.html 

IEC TR 62921

  
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